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  pb lead-free parts LUR22740-PF - 2008 11 - sep. data sheet LUR22740-PF ligitek electronics co.,ltd. property of ligitek only doc. no : qw0905- rev. : a date : super bright round type led lamps
1.0min 25.0min 5.0 3.0 3.8 0.5 typ 2.54typ 1.5 max 4.4 + - 1/5 page LUR22740-PF part no. ligitek electronics co.,ltd. property of ligitek only directivity radiation note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. package dimensions 100% 60 30 0 50% 0 25% -30 50% 100%75% -60 25%75%
note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. absolute maximum ratings at ta=25 i fp pd i f tstg t opr symbol typical electrical & optical characteristics (ta=25 ) power dissipation reverse current @5v storage temperature operating temperature parameter peak forward current duty 1/10@10khz forward current 120 -40 ~ +100 -40 ~ +85 ir10 ratings ur 120 40 mw a ma ma unit ligitek electronics co.,ltd. property of ligitek only page 2/5 viewing angle 2 1/2 (deg) min. 20 min. 1.5 forward voltage @ ma(v) max. 2.4 peak wave length pnm 660 spectral halfwidth nm 20 typ. luminous intensity @20ma(mcd) emitted red part no LUR22740-PF material gaalas lens color red diffused 54 part no. LUR22740-PF 550 300
ligitek electronics co.,ltd. property of ligitek only 0.0 0.8 f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 wavelength (nm) ambient temperature( ) fig.5 relative intensity vs. wavelength r e l a t i v e i n t e n s i t y @ 2 0 m a 1.0 0.0 600 0.5 -40-20 650700750 -40 80 20 04060100 ambient temperature( ) -20040 20100 80 60 1 f o r w a r d c u r r e n t ( m a ) r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a fig.3 forward voltage vs. temperature 0.9 1.0 1.1 1.2 0 1 1.0 1.0 0.5 1.5 2.0 2.5 3.0 1 fig.4 relative intensity vs. temperature forward voltage(v) 3.0 2.04.0 0.0 5.0 0.5 forward current(ma) 100 101000 fig.1 forward current vs. forward voltage typical electro-optical characteristics curve 10 100 1000 ur chip fig.2 relative intensity vs. forward current 2.5 1.5 1.0 2.0 3.0 page3/5 part no. LUR22740-PF
note: 1.wave solder should not be made more than one time. 2.you can just only select one of the soldering conditions as above. 60 seconds max page 4/5 2.wave soldering profile ligitek electronics co.,ltd. property of ligitek only soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time only) distance:2mm min(from solder joint to body) dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) time(sec) 150 260 c/3sec max 100 5 /sec max 50 preheat 2 /sec max 260 120 0 0 25 temp( c) part no. LUR22740-PF
page 5/5 reference standard mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-202:103b jis c 7021: b-11 mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 mil-std-883:1008 jis c 7021: b-10 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 test item operating life test test condition 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) low temperature storage test high temperature high humidity test solder resistance test thermal shock test 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs 1.t.sol=260 5 2.dwell time= 10 1sec. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) high temperature storage test reliability test: solderability test 1.t.sol=230 5 2.dwell time=5 1sec ligitek electronics co.,ltd. property of ligitek only description the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. the purpose of this test is the resistance of the device under tropical for hours. this test intended to see soldering well performed or not. part no. LUR22740-PF


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